[Soft-matter] Invitation to Warsaw Soft Matter Day 2026

[Tomasz Wacławczyk]

Dear Colleagues,

It is our great pleasure to invite you to *Warsaw Soft Matter Day 2026* 
<https://warsawsoftmatterday2026.github.io/warsawsoftmatterday2026/>, a 
one-day, fee-free scientific
conference devoted to current advances and emerging perspectives in the 
broad and interdisciplinary
field of soft matter.

The conference will take place on *28 September 2026*at the *Warsaw 
University of Technology*, *
Institute of Heat Engineering*, *T1 Lecture Hall (ground floor)*, ul. 
Nowowiejska 21/25, 00-665 Warsaw, Poland.

Warsaw Soft Matter Day 2026 is intended as a forum for the exchange of 
ideas among researchers working
at the interface of physics, chemistry, materials science, engineering, 
and related disciplines. The meeting will
provide an excellent opportunity to present recent results, discuss 
ongoing challenges, and strengthen
collaborations within the soft matter community.

We would be honored by your presence and sincerely hope that you will 
join us in Warsaw
for a day of engaging presentations, insightful discussions, and vibrant 
scientific exchange.

Please note that registration is required 
<https://warsawsoftmatterday2026.github.io/warsawsoftmatterday2026/> in 
order to participate in the conference.

Yours sincerely,
on behalf of the Organizing Committee,

Tomasz Wacławczyk, PhD, DSc Eng.

*P.S.* Please accept our apologies if you receive this invitation 
multiple times.


*Faculty of Power and Aeronautical Engineering*
Institute of Aeronautics and Applied Mechanics
Division of Aerodynamics

ul. Nowowiejska 21/25
00-665 Warszawa, Polska
tel. +48 (22) 234 77 68

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://tempulin.fuw.edu.pl/pipermail/soft-matter/attachments/20260504/351d2af7/attachment-0001.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: PW_logo_z_napisem_ENG.png
Type: image/png
Size: 75846 bytes
Desc: not available
URL: <http://tempulin.fuw.edu.pl/pipermail/soft-matter/attachments/20260504/351d2af7/attachment-0001.png>